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Timo Aalto, VTT Technical Research Centre of Finland LTD, Espoo, Finland
Veli-Matti Airaksinen, IMARINS, Espoo, Finland
Marco Amiotti, SAES Getters S.p.A., Lainate, Italy
Olli Anttila, Silicom Ltd., Helsinki, Finland
Antonio Bonucci, SAES Getters S.p.A., Lainate, Italy
K. Brudziński, The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland
Rob N. Candler, Department of Electrical Engineering, University of California, Los Angeles, USA
Zhen Cao, Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong
Kuo-Shen Chen, Department of Mechanical Engineering, National Cheng-Kung University Tainan, Tainan, Taiwan
Andrea Conte, SAES Getters S.p.A., Lainate, Italy
Cristina E. Davis, Department of Mechanical and Aerospace Engineering, University of California, Davis, USA
Pradeep Dixit, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, India
Viorel Dragoi, EV Group E.Thallner GmbH, St. Florian/Inn, Austria
Simo Eränen, VTT Technical Research Centre of Finland LTD, Espoo, Finland
Andreas C. Fischer, Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden
Sami Franssila, Department of Materials Science and Engineering, Aalto University, Espoo, Finland
Alois Friedberger, EADS Innovation Works, München, Germany
Maria Ganchenkova, Department of Applied Physics, Aalto University, Espoo, Finland
Pilar Gonzalez, Interuniversity Microelectronics Centre (IMEC), Leuven, Belgium
Miguel A. Gosálvez, Laboratory of Physics, Aalto University, Espoo, Finland
J. Gronicz, The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland
Atte Haapalinna, Okmetic Oyj, Vantaa, Finland
Paul M. Hagelin, SiTime Corporation, Sunnyvale, USA
Paul Hammond, SPTS Technologies, Allentown, USA
Kimmo Henttinen, Okmetic Oyj, Vantaa, Finland
David Horsley, Department of Mechanical and Aerospace Engineering, University of California, Davis, USA
Akihisa Inoue, Institute for Materials Research, Tohoku University, Sendai, Japan
Henrik Jakobsen, Department of Micro and Nano Systems Technology, Buskerud and Vestfold University College, Borre, Norway
Kerstin Jonsson, NanoSpace AB, Uppsala Science Park, Uppsala, Sweden
Dirk Kähler, Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany
Hannu Kattelus, VTT MEMSFAB, Espoo, Finland
Roy Knechtel, X-FAB MEMS Foundry GmbH Erfurt, Haarbergstraβe, Germany
Kathrin Knese, Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
Kai Kolari
VTT Technical Research Centre of Finland LTD, Espoo, Finland
currently at Murata Electronics, Vantaa, Finland
Mika Koskenvuori, Nanofab, Micronova, Aalto University, Espoo, Finland
Heikki Kuisma, Murata Electronics Oyj, Vantaa, Finland
Amit Kulkarni, Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany
Franz Laermer, Robert Bosch GmbH Stuttgart, Germany, Applied Research 1, Microsystems Technologies
Adriana Cozma Lapadatu, poLight AS, Horten, Norway
Christina Leinenbach, Robert Bosch GmbH, Stuttgart, Germany
Michael K. LeVasseur, Department of Mechanical and Aerospace Engineering, University of California, Davis, USA
Jue Li, Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland
Paul Lindner, EV Group E.Thallner GmbH, St. Florian/Inn, Austria
Veikki Lindroos, Department of Materials Science and Engineering, Aalto University, Espoo, Finland
Fabian Lofink, Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany
Giorgio Longoni, SAES Getters S.p.A., Lainate, Italy
Jari Mäkinen, Okmetic Oyj, Vantaa, Finland
Matti Mäntysalo, Department of Electronics and Communications Engineering, Tampere University of Technology, Tampere, Finland
Devin Martin, DISCO HI-TEC America, Inc., Santa Clara, USA
Toni Mattila, Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland
Luca Mauri, SAES Getters S.p.A., Lainate, Italy
Peter Merz, XFAB MEMS Foundry GmbH, Itzehoe, Germany
Doug Meyer, Gallia Semiconductor, Portland, USA
Marco Moraja, SAES Getters S.p.A., Lainate, Italy
Teruaki Motooka, Department of Materials Science and Engineering, Kyushu University, Fukuoka, Japan
Gerhard Müller, EADS Innovation Works, München, Germany
Paul Muralt, EPFL, Lausanne, Switzerland
S. Nagao, The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland
Risto M. Nieminen, Department of Applied Physics, Aalto University, Espoo, Finland
Frank Niklaus, Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden
R. Nowak, Department of Materials Science and Engineering and The Nordic Hysitron Laboratory, Aalto University, Espoo, Finland
Juuso Olkkonen, VTT Technical Research Centre of Finland LTD, Espoo, Finland
Kuang-Shun Ou, Department of Mechanical Engineering, National Cheng-Kung University Tainan, Tainan, Taiwan
Jari Paloheimo, Okmetic Oyj, Vantaa, Finland
Mervi Paulasto-Kröckel, Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland
Helena Pohjonen, Nokia Technologies, Espoo, Finland
Klaus Pressel, Infineon Technologies AG, Regensburg, Germany
Matti Putkonen, VTT Technical Research Centre of...
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